System on chip or system on package?

被引：80

作者：

Tummala, RR ^{[1
]}

Madisetti, VK ^{[1
]}

机构：

[1] Georgia Inst Technol, Sch Elect & Comp Engn, Atlanta, GA 30332 USA

来源：

IEEE DESIGN & TEST OF COMPUTERS | 1999年 / 16卷 / 02期

关键词：

D O I：

10.1109/54.765203

中图分类号：

TP3 [计算技术、计算机技术];

学科分类号：

0812 ;

摘要：

The authors propose a new system design paradigm, the system on package, which uses electronic product reengineering to meet time-to-market and performance requirements. The system on package promises a higher return on investment than the system on chip.

引用

页码：48 / 56

页数：9

共 5 条

[1]

*AN PACK SYST, 1998, IEEE DES TEST COMP

[2]

Choi KL, 1998, IEEE T COMPON PACK B, V21, P258, DOI 10.1109/96.704936

[3] Long lossy lines (L-3) and their impact upon large chip performance [J].

Davidson, EE ;

McCredie, BD ;

Vilkelis, WV .

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING, 1997, 20 (04) :361-375

[4]

FRANZON P, IEEE T COMPONENTS B, V18, P620

[5]

Tummala R., 1997, Microelectronics Packaging Handbook: Technology Drivers

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