Stress-buffer and passivation processes for Si and GaAsIC's and passive components using photosensitive BCB: Process technology and reliability data

被引：36

作者：

Garrou, PE ^{[1
]}

Rogers, WB

Scheck, DM

Strandjord, AJG

Ida, Y

Ohba, K

机构：

[1] Dow Chem, Res Triangle Pk, NC 27709 USA

[2] Unitive Elect, Res Triangle Pk, NC 27709 USA

[3] IC Interconnect, Boulder, CO 80303 USA

[4] Dow Chem, Gotemba, Japan

来源：

IEEE TRANSACTIONS ON ADVANCED PACKAGING | 1999年 / 22卷 / 03期

关键词：

air bridges; GaAs; integrated passives; passivation; passives; photo-BCB; resistor nets; SBL; stress buffer layer;

D O I：

10.1109/6040.784503

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Polymer coatings are applied to chips and passive components to provide stress relief between the device/component and the plastic package and/or to provide mechanical and environmental protection. The semiconductor industry is actively pursuing a one mask, photosensitive dielectric process far stress-buffer and secondary passivation of memory die. A one mask photo-benzocyclobutene (BCB) process is compared to traditional two mask wet etch processes. This new one mask process reveals 1/3 the total wafer processing time and equivalent reliability (traditional MIL 883C testing) for passivated 100 lead static random access memory components (SRAM's). Reliability data are also presented for GaAs chips, and NiCr and TaN resistors which have been passivated by BCB.

引用

页码：487 / 498

页数：12

共 54 条

[1]

[Anonymous], 1990, PLASTIC PACKAGING MI

[2] FEASIBILITY OF BCB AS AN INTERLEVEL DIELECTRIC IN INTEGRATED-CIRCUITS [J].

BOTHRA, S ;

KELLAM, M ;

GARROU, P .

JOURNAL OF ELECTRONIC MATERIALS, 1994, 23 (08) :819-825

[3]

Bristow J, 1996, P SOC PHOTO-OPT INS, V2920, P138

[4] BENZOCYCLOBUTENE (BCB) DIELECTRICS FOR THE FABRICATION OF HIGH-DENSITY, THIN-FILM MULTICHIP MODULES [J].

BURDEAUX, D ;

TOWNSEND, P ;

CARR, J ;

GARROU, P .

JOURNAL OF ELECTRONIC MATERIALS, 1990, 19 (12) :1357-1364

[5]

CASE C, 1996, P VMIC C, P63

[6]

CLEARFIELD H, COMMUNICATION

[7] Integrated passive devices using Al/BCB thin films [J].

Clearfield, HM ;

Wijeyesekera, S ;

Logan, EA ;

Luu, A ;

Gieser, D ;

Lin, CM ;

Jing, J ;

Rogers, WB ;

Scheck, D ;

Benson, D ;

He, J .

1998 INTERNATIONAL CONFERENCE ON MULTICHIP MODULES AND HIGH DENSITY PACKAGING, PROCEEDINGS, 1998, :501-505

[8]

CZOMYI G, 1997, MICROELECTRONIC PA 2, pCH11

[9]

DAHLGREN U, 1994, P IEEE MMTS INT MICR, V2, P661

[10]

DESHPANDE U, 1997, P ISHM, P496

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