Heat dissipation design and analysis of high power LED array using the finite element method

被引:124
作者
Cheng, Hui Huang [1 ]
Huang, De-Shau [2 ]
Lin, Ming-Tzer [1 ]
机构
[1] Natl Chung Hsing Univ, Grad Inst Precis Engn, Taichung 402, Taiwan
[2] Nan Kai Univ Technology, Grad Sch Vehicle & Mechatron Ind, Nantou 542, Taiwan
关键词
D O I
10.1016/j.microrel.2011.05.009
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
High-power Light Emitting Diode (LED) technology has developed rapidly in recent years from illumination to display applications. However, the rate of heat generation increases with the LED illumination intensity. The LED chip temperature has an inverse proportion with the LED lifetime. High-power LED arrays with good thermal management can have improved lifetime. Therefore, for better optical quality and longer LED lifetime it is important to solve the LED thermal problems of all components. In particular, Metal Core Printed Circuit Board (MCPCB) substrate heat sink design and thermal interface materials are key issues for thermal management. This paper presents an integrated multi-fin heat sink design with a fan on MCPCB substrate for a high-power LED array using the finite element method (FEM). The multi-fin heat sink design and simulation results provide useful information for LED heat dissipation and chip temperature estimation. Crown Copyright (C) 2011 Published by Elsevier Ltd. All rights reserved.
引用
收藏
页码:905 / 911
页数:7
相关论文
共 8 条
[1]  
Colgan EG, 2005, P IEEE SEMICOND THER, P1
[2]  
HAQUE S, 2003, PACKAGING CHALLENGES
[3]   Thermal analysis of LED array system with heat pipe [J].
Kim, Lan ;
Choi, Jong Hwa ;
Jang, Sun Ho ;
Shin, Moo Whan .
THERMOCHIMICA ACTA, 2007, 455 (1-2) :21-25
[4]   COOLING CHARACTERISTICS OF DIAMOND-SHAPED INTERRUPTED COOLING FIN FOR HIGH-POWER LSI DEVICES [J].
KISHIMOTO, T ;
SASAKI, S .
ELECTRONICS LETTERS, 1987, 23 (09) :456-457
[5]  
LEE CR, 2006, THESIS NATL CHENG KU
[6]  
Mehmet A, 2004, P SPOIE, V5530, P214
[7]   Thermal Diffusion Analysis for LED Module [J].
Su, Ay ;
Liu, Y. ;
Chen, C. .
HEAT TRANSFER-ASIAN RESEARCH, 2007, 36 (08) :449-458
[8]   HIGH-PERFORMANCE HEAT SINKING FOR VLSI [J].
TUCKERMAN, DB ;
PEASE, RFW .
ELECTRON DEVICE LETTERS, 1981, 2 (05) :126-129