Laser Direct Writing of circuit elements and sensors

A novel approach for maskless deposition of numerous materials has been developed at the Naval Research Laboratory. This technique evolved from the combination of Laser Induced Forward Transfer (LIFT) and Matrix Assisted Pulsed Laser Evaporation (MAPLE), and utilizes a computer controlled laser micromachining system. The resulting process is called MAPLE-DW for MAPLE Direct Write. MAPLE-DW can be used for the rapid fabrication of circuits and their components without the use of masks. Using MAPLE-DW, a wide variety of materials have been transferred over different types of substrates such as glass, alumina, plastics, and various types of circuit boards. Materials such as metals, dielectrics, ferrites, polymers and composites have been successfully deposited without any loss in functionality. Using a computer controlled stage, the above mentioned materials were deposited at room temperature over various substrates independent of their surface morphology, with sub-10 mu m resolution. In addition, multilayer structures comprising of different types of materials were demonstrated by this technique. These multilayer structures form the basis of prototype thin film electronic devices such as resistors, capacitors, cross-over lines, inductors, etc. An overview of the results obtained using MAPLE-DW as well as examples of several devices made using this technique is presented.