Quality factors of MEMS gyros and the role of thermoelastic damping

被引：17

作者：

Duwel, A ^{[1
]}

Weinstein, M ^{[1
]}

Gorman, J ^{[1
]}

Borenstein, J ^{[1
]}

Ward, P ^{[1
]}

机构：

[1] MIT, Draper Labs, Cambridge, MA 02139 USA

来源：

FIFTEENTH IEEE INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS, TECHNICAL DIGEST | 2002年

关键词：

D O I：

10.1109/MEMSYS.2002.984242

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

In this paper, we present new experimental data illustrating the importance of thermoelastic damping in MEMS resonant sensors. We have used MEMS gyroscopes to demonstrate that both the choice of materials and variations in device design can lead to significant differences in the measured Quality (Q) factors of the device. These differences in Q factor can be explained by including the contribution of thermoelastic damping (TED), which varies strongly between the different silicon etch-stop compositions used in this study. Known damping mechanisms such as fluid damping, anchor damping, and electronics damping are minimized and held fixed in this experiment so that materials effects can be isolated.

引用

页码：214 / 219

页数：6

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