A new method to study cyclic deformation of thin films in tension and compression

被引：71

作者：

Hommel, M ^{[1
]}

Kraft, O ^{[1
]}

Arzt, E ^{[1
]}

机构：

[1] Max Planck Inst Met Forsch, D-70174 Stuttgart, Germany

来源：

JOURNAL OF MATERIALS RESEARCH | 1999年 / 14卷 / 06期

关键词：

D O I：

10.1557/JMR.1999.0317

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

In this paper, a new method to study cyclic plastic deformation in thin metal films is presented. Cu films were deposited onto compliant substrates allowing the film to be subjected to tensile and compressive stresses on loading and unloading of the film/substrate composite. The film stress was measured in situ by x-ray diffraction. First results lend to characteristic stress-strain hysteresis curves, indicative of fatigue processes in small dimensions.

引用

页码：2373 / 2376

页数：4

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