Microstructure-electromigration correlation in a thin stripe of eutectic SnPb solder stressed between Cu electrodes

被引：147

作者：

Liu, CY ^{[1
]}

Chen, C ^{[1
]}

Liao, CN ^{[1
]}

Tu, KN ^{[1
]}

机构：

[1] Univ Calif Los Angeles, Dept Mat Sci & Engn, Los Angeles, CA 90095 USA

来源：

APPLIED PHYSICS LETTERS | 1999年 / 75卷 / 01期

关键词：

D O I：

10.1063/1.124276

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

Room-temperature electromigration occurs in a thin stripe of eutectic SnPb solder stressed by a current density of 10(5) amp/cm(2). Hillocks and voids grow at the anode and the cathode, respectively. While the dominant diffusion species is Sn in this two-phase alloy, the growth of the hillocks, surprisingly, originates from the Pb grains. (C) 1999 American Institute of Physics. [S0003-6951(99)02827-2].

引用

页码：58 / 60

页数：3

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