High-resolution three-dimensional reconstruction: A combined scanning electron microscope and focused ion-beam approach

被引:29
作者
Bansal, RK [1 ]
Kubis, A [1 ]
Hull, R [1 ]
Fitz-Gerald, JM [1 ]
机构
[1] Univ Virginia, Dept Mat Sci & Engn, Charlottesville, VA 22904 USA
来源
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B | 2006年 / 24卷 / 02期
关键词
D O I
10.1116/1.2167987
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The ability to obtain three-dimensional information has always been important to gain insight and understanding into material systems. Three-dimensional reconstruction often reveals information about the morphology and composition of a system that can otherwise be obscured or misinterpreted by two-dimensional images. In this article, we describe tomographic measurements with 10 nm scale resolution, combining focused ion-beam processing with field-emission scanning electron microscopy to obtain a series of high-resolution two-dimensional cross-sectional images. The images were then concatenated in a computer and interpolated into three-dimensional space to assess and visualize the structure of the material. The results of this research demonstrate the use of tomographic reconstruction of Si-Si/Ge and theta' Al2CU samples to reproduce the three-dimensional morphology with sub-10 nm resolution. (c) 2006 American Vacuum Society.
引用
收藏
页码:554 / 561
页数:8
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