Enhanced tensile ductility and toughness in nanostructured Cu

被引：246

作者：

Wang, YM

Ma, E ^{[1
]}

Chen, MW

机构：

[1] Johns Hopkins Univ, Dept Mat Sci & Engn, Baltimore, MD 21218 USA

[2] Johns Hopkins Univ, Dept Mech Engn, Baltimore, MD 21218 USA

来源：

APPLIED PHYSICS LETTERS | 2002年 / 80卷 / 13期

关键词：

D O I：

10.1063/1.1465528

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

Pure copper with ultrafine grain sizes and nanoscale subgrain (dislocation) structures was prepared by using severe plastic deformation through cold rolling at subambient temperatures, with or without subsequent recovery annealing. We report coexisting high strength and tensile ductility (large elongation to failure and ductile fracture). Factors leading to the simultaneous strengthening and toughening with increasing cold deformation and microstructural refinement are discussed. (C) 2002 American Institute of Physics.

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页码：2395 / 2397

页数：3

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