Pt/Ti thin film adhesion on SiNx/Si substrates

被引：10

作者：

Kang, U

Lee, T

Kim, YH

机构：

[1] Hanyang Univ, Dept Mat Engn, Seoul 133791, South Korea

[2] Samsung Electromech Co Ltd, Package Technol Team, Chungcheongnam Do 339860, South Korea

来源：

JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS | 1999年 / 38卷 / 7A期

关键词：

adhesion; scratch test; Pt/Ti; bottom electrode; peel test;

D O I：

10.1143/JJAP.38.4147

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

The adhesion of Pt/Ti thin films on SiNx/Si substrates with respect to the substrate pretreatment and annealing ambient was investigated using the adhesive tape test, the peel test, and the scratch test. Pt/Ti thin films were deposited a DC magnetron sputtering system. The in situ Ar+ RF plasma treatment was more effective in enhancing adhesion between the Pt/Ti thin films and the SiNx/Si substrate than chemical cleaning. After annealing in an oxygen ambient, the adhesion of the Pt/Ti/SiNx/Si specimen was degraded. This adhesion degradation was attributed to the depletion of the Ti adhesion layer due to the formation of the rutile TiO2 phase.

引用

页码：4147 / 4151

页数：5

共 19 条

[1] THE RELATIONSHIP BETWEEN HARDNESS AND SCRATCH ADHESION [J].