Thick-film sensors: Past, present and future

被引：194

作者：

White, NM

Turner, JD

机构：

[1] Fac. of Eng. and Applied Science, University of Southampton

[2] Instrum. Sci. and Technology Group, Institute of Physics

[3] Hawker Siddeley Aviation, Hatfield

[4] Royal Academy of Engineering, Department of Mechanical Engineering, Southampton University

来源：

MEASUREMENT SCIENCE AND TECHNOLOGY | 1997年 / 8卷 / 01期

关键词：

D O I：

10.1088/0957-0233/8/1/002

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

A review of thick-film sensors is presented. The evolution of the technology to a successful enabling mechanism for solid-state sensors is described. Many examples of applications in the major signal domains (mechanical, radiant, thermal, magnetic and chemical) are cited. The important characteristics of the technology relating to hybrid circuits, support structures and primary sensing elements are illustrated, The future of thick-film sensors is discussed in the light of the rapid development of new materials for sensors that have emerged over recent years.

引用

页码：1 / 20

页数：20

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