Diffusional creep: Stresses and strain rates in thin films and multilayers

被引：27

作者：

Josell, D ^{[1
]}

Weihs, TP

Gao, H

机构：

[1] Natl Inst Stand & Technol, Gaithersburg, MD 20899 USA

[2] Johns Hopkins Univ, Dept Mat Sci & Engn, Baltimore, MD 21218 USA

[3] Max Planck Inst Met Res, Stuttgart, Germany

[4] Stanford Univ, Dept Mech Engn & Mat Sci, Stanford, CA 94305 USA

[5] Stanford Univ, Dept Engn, Stanford, CA 94305 USA

来源：

MRS BULLETIN | 2002年 / 27卷 / 01期

关键词：

diffusional creep; mechanical properties; thin films;

D O I：

10.1557/mrs2002.18

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

In this article, we discuss creep deformation as it relates to thin films and multilayer foils. We begin by reviewing experimental techniques for studying creep deformation In thin-film geometries, listing the pros and cons of each; then we discuss the use of deformation-mechanism maps for recording and understanding observed creep behavior. We include a number of cautionary remarks regarding the impact of microstructural stability, zero-creep stresses, and transient-creep strains on stress-strain rate relationships, and we finish by reviewing the current state of knowledge for creep deformation in thin films. This includes both thin films that are heated on substrates as well as multilayer films that are tested as freestanding foils.

引用

页码：39 / 44

页数：6

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