The Surface Chemistry of Atomic Layer Deposition (ALD) Processes for Metal Nitride and Metal Oxide Film Growth

被引:22
作者
Bouman, M. [1 ]
Zaera, F. [1 ]
机构
[1] Univ Calif Riverside, Dept Chem, Riverside, CA 92521 USA
来源
ATOMIC LAYER DEPOSITION APPLICATIONS 6 | 2010年 / 33卷 / 02期
基金
美国国家科学基金会;
关键词
CHEMICAL-VAPOR-DEPOSITION; TITANIUM NITRIDE; MASS-SPECTROMETRY; THIN-FILMS; TIN FILMS; MECHANISTIC DETAILS; TETRAKIS(DIMETHYLAMIDO)TITANIUM; TDMAT; DECOMPOSITION; TECHNOLOGY;
D O I
10.1149/1.3485266
中图分类号
O646 [电化学、电解、磁化学];
学科分类号
081704 ;
摘要
The surface and gas-phase thermal chemistry of tetrakis(ethylmethylamido)titanium (TEMAT), by itself and in the presence of water, was investigated by using transmission infrared (IR) absorption spectroscopy and tandem gas chromatographymass spectrometry (GC-MS). Using IR spectroscopy, the uptake of TEMAT was contrasted on hydrogen-terminated versus native-oxide-covered surfaces of Si(100) substrates, and the self-limiting nature of the uptake on the native oxide was assessed in the temperature range from 140 to 280 degrees C. It was found that the uptake of TEMAT is indeed partially self-limiting, but that a CVD component from precursor decomposition does contribute to the deposition of Ti, a contribution that becomes more apparent with increasing temperatures. It was also found that decomposition of the amido ligands on the surface leads to the formation of surface species containing C=N bonds, most likely imine intermediates produced by beta-hydride eliminations steps. Furthermore, it was demonstrated that a controlled thin film containing Ti species can be deposited by means of TEMAT self-limiting adsorption at 150 degrees C followed by thermal decomposition at 325 degrees C. To further understand the thermal chemistry of TEMAT, a novel approach was successfully tested where the reaction products from gas-phase reactions of TEMAT, alone and in the presence of H2O, were analyzed using tandem GC-MS. It was found that TEMAT can decompose through a reductive coupling mechanism in which N, N'-diethyl-N'N'-dimethylhydrazine is formed. In contrast, addition of water to the reaction mixture promotes a competing ligand hydrogenation reaction to form ethylmethylamine instead.
引用
收藏
页码:291 / 305
页数:15
相关论文
共 43 条
[1]  
[Anonymous], 2003, NIST STAND REF DAT
[2]  
Böscke T, 2006, PROC EUR S-STATE DEV, P391
[3]   Tantalum nitride atomic layer deposition using (tert-butylimido) tris(diethylamido) tantalum and hydrazine [J].
Burton, B. B. ;
Lavoie, A. R. ;
George, S. M. .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2008, 155 (07) :D508-D516
[4]   Titanium nitride diffusion barrier for copper metallization on gallium arsenide [J].
Chen, HC ;
Tseng, BH ;
Houng, MP ;
Wang, YH .
THIN SOLID FILMS, 2003, 445 (01) :112-117
[5]  
Choe H. S., 1999, Proceedings of the IEEE 1999 International Interconnect Technology Conference (Cat. No.99EX247), P62, DOI 10.1109/IITC.1999.787079
[6]   Chemical vapour deposition of coatings [J].
Choy, KL .
PROGRESS IN MATERIALS SCIENCE, 2003, 48 (02) :57-170
[7]   Gas-Phase Thermolysis of a Guanidinate Precursor of Copper Studied by Matrix Isolation, Time-of-Flight Mass Spectrometry, and Computational Chemistry [J].
Coyle, Jason P. ;
Johnson, Paul A. ;
DiLabio, Gino A. ;
Barry, Sean T. ;
Mueller, Jens .
INORGANIC CHEMISTRY, 2010, 49 (06) :2844-2850
[8]   INFRARED STUDIES OF THE SURFACE AND GAS-PHASE REACTIONS LEADING TO THE GROWTH OF TITANIUM NITRIDE THIN-FILMS FROM TETRAKIS(DIMETHYLAMIDO)TITANIUM AND AMMONIA [J].
DUBOIS, LH ;
ZEGARSKI, BR ;
GIROLAMI, GS .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1992, 139 (12) :3603-3609
[9]   Surface chemistry and film growth during TiN atomic layer deposition using TDMAT and NH3 [J].
Elam, JW ;
Schuisky, M ;
Ferguson, JD ;
George, SM .
THIN SOLID FILMS, 2003, 436 (02) :145-156
[10]   TiO2 atomic layer deposition on ZrO2 particles using alternating exposures of TiCl4 and H2O [J].
Ferguson, JD ;
Yoder, AR ;
Weimer, AW ;
George, SM .
APPLIED SURFACE SCIENCE, 2004, 226 (04) :393-404