Optomechanical design and characterization of a printed-circuit-board-based free-space optical interconnect package

被引:20
作者
Zheng, XZ [1 ]
Marchand, PJ [1 ]
Huang, DW [1 ]
Kibar, O [1 ]
Ozkan, NSE [1 ]
Esener, SC [1 ]
机构
[1] Univ Calif San Diego, Dept Elect & Comp Engn, La Jolla, CA 92093 USA
关键词
D O I
10.1364/AO.38.005631
中图分类号
O43 [光学];
学科分类号
070207 ; 0803 ;
摘要
We present a proof of concept and a feasibility demonstration of a practical packaging approach in which free-space optical interconnects (FSOI's) can be integrated simply on electronic multichip modules (MCM's) for intra-MCM-board interconnects. Our system-level packaging architecture is based on a modified folded 4f imaging system that has been implemented with only off-the-shelf optics, conventional electronic packaging, and passive-assembly techniques to yield a potentially low-cost and manufacturable packaging solution. The prototypical system as built supports 48 independent FSOI channels with 8 separate laser and detector chips, for which each chip consists of a one-dimensional array of 12 devices. All the chips are assembled on a single substrate that consists of a printed circuit board or a ceramic MCM. Optical link channel efficiencies of greater than 90% and interchannel cross talk of less than -20 dB at low frequency have been measured. The system is compact at only 10 in.(3) (25.4 cm(3)) and is scalable, as it can easily accommodate additional chips as well as two-dimensional optoelectronic device arrays for increased interconnection density. (C) 1999 Optical Society of America.
引用
收藏
页码:5631 / 5640
页数:10
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