Palladium composite membranes by electroless plating technique - Relationships between plating kinetics, film microstructure and membrane performance

被引：118

作者：

Yeung, KL ^{[1
]}

Christiansen, SC ^{[1
]}

Varma, A ^{[1
]}

机构：

[1] Univ Notre Dame, Dept Chem Engn, Notre Dame, IN 46556 USA

来源：

JOURNAL OF MEMBRANE SCIENCE | 1999年 / 159卷 / 1-2期

基金：

美国国家科学基金会;

关键词：

palladium membranes; electroless plating technique; film microstructure; plating kinetics; hydrogen permeation;

D O I：

10.1016/S0376-7388(99)00041-1

中图分类号：

TQ [化学工业];

学科分类号：

0817 ;

摘要：

Thin supported palladium membranes were prepared using electroless plating technique. The intrinsic plating kinetics were determined for hydrazine-based palladium plating baths. Mathematical models were developed to predict film thickness and plating rate as a function of plating parameters (i.e., reactant concentrations, temperature and time). Analyses of film surface microstructure indicate that grain structure is dependent on both plating chemistry and plating rate. The evolution of film morphology during electroless plating was also investigated. Hydrogen permeation study demonstrated that film structure has a significant influence on the permeation performance of the palladium membrane. (C) 1999 Elsevier Science B.V. All rights reserved.

引用

页码：107 / 122

页数：16

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