Effect of current crowding on void propagation at the interface between intermetallic compound and solder in flip chip solder joints

被引：143

作者：

Zhang, LY ^{[1
]}

Ou, SQ

Huang, J

Tu, KN

Gee, S

Nguyen, L

机构：

[1] Univ Calif Los Angeles, Dept Mat Sci & Engn, Los Angeles, CA 90095 USA

[2] Natl Semicond Corp, Santa Clara, CA 95051 USA

来源：

APPLIED PHYSICS LETTERS | 2006年 / 88卷 / 01期

基金：

美国国家科学基金会;

关键词：

D O I：

10.1063/1.2158702

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

We propose a kinetic model to describe a pancake-type void propagation in flip chip solder joints due to current crowding in electromigration. The divergence of the vacancy fluxes at the interface between the solder and Cu6Sn5 leads to void formation and propagation along the interface between them. Based on the continuity condition, the void growth velocity is calculated. The theoretical calculations are in reasonable agreement with the experimental results. (c) 2006 American Institute of Physics.

引用

页数：3

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