The influence of copper nanopowders on microstructure and hardness of lead-tin solder

被引：69

作者：

Lin, D

Wang, GX

Srivatsan, TS ^{[1
]}

Al-Hajri, M

Petraroli, M

机构：

[1] Univ Akron, Dept Mech Engn, Akron, OH 44325 USA

[2] Timken Co, Timken Res, Canton, OH 44706 USA

来源：

MATERIALS LETTERS | 2002年 / 53卷 / 4-5期

基金：

美国国家科学基金会;

关键词：

Sn-Pb eutectic; copper nanopowders; composite solder; microstructure; microhardness;

D O I：

10.1016/S0167-577X(01)00503-1

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

This paper presents the microstructure and hardness of composite solders obtained by the addition of nanopowders of copper to a conventional solder. Copper powders-reinforced lead (Pb)-tin (Sn) composite solders were prepared by thoroughly blending nano-sized copper powders (average powder particle size 100 nm) with a powder of a eutectic solder and using a water-soluble flux. The blended solder paste was melted and allowed to re-solidify in a crucible placed on a hot plate and maintained at a constant temperature. Optical microscopy observations revealed the as-solidified microstructure of the composite solder to be altered by the addition of nanopowders to the eutectic Sn-Pb solder. The copper powders precipitated as intermetallic compounds that were non-uniformly distributed through the microstructure. Microhardness measurements revealed a 30-40% increase in hardness of the composite solder over the conventional unreinforced eutectic counterpart. (C) 2002 Published by Elsevier Science B.V.

引用

页码：333 / 338

页数：6

共 10 条

[1]

BOUDREAU RA, 1994, JOM-J MIN MET MAT S, V46, P41

[2]

Clough R. B., 1992, Proceedings of the Technical Program. NEPCON West '92, P1256

[3]

Marshall J. L., 1997, Soldering & Surface Mount Technology, V9, P22, DOI 10.1108/09540919710800647

[4] COMPOSITE SOLDERS [J].

MARSHALL, JL ;

CALDERON, J ;

SEES, J ;

LUCEY, G ;

HWANG, JS .

IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1991, 14 (04) :698-702

[5]

RENO C, 1997, J ELECT MAT, V26, P12

[6]

SASTRY SML, 1993, MECH SOLDER WETTING

[7]

Wasynchzuk J. A., 1992, Proceedings of the Technical Program. NEPCON West '92, P1245

[8] THE FORMATION AND GROWTH OF INTERMETALLICS IN COMPOSITE SOLDER [J].

WU, YJ ;

SEES, JA ;

POURAGHABAGHER, C ;

FOSTER, LA ;

MARSHALL, JL ;

JACOBS, EG ;

PINIZZOTTO, RF .

JOURNAL OF ELECTRONIC MATERIALS, 1993, 22 (07) :769-777

[9]

YU SP, 2000, J MET JUN, P36

[10]

1986, IBM TECH DISCL B, V29, P1573

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