A novel method for measuring the strength of microbeams

被引：6

作者：

Elata, D ^{[1
]}

Hirshberg, A ^{[1
]}

机构：

[1] Technion Israel Inst Technol, Fac Mech Engn, IL-32000 Haifa, Israel

来源：

JOURNAL OF MICROELECTROMECHANICAL SYSTEMS | 2006年 / 15卷 / 02期

关键词：

mechanical test device; strength of microstructures;

D O I：

10.1109/JMEMS.2006.872237

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

A novel method and test structure for measuring the strength of brittle microbeams is presented. The method does not require any measurement of forces or displacements. The test structure includes a microbeam that is wrapped over a curved side-wall by application of an unmeasured force. With the progression of wrapping, increasing tensile stresses are induced in the microbeam. When sufficiently high stresses are induced, the beam breaks. The failure stress is deduced by measuring the length of the remaining ligament of the broken beam. The method is demonstrated by measuring the strength of microbeams; in bulk-micromachined test structures.

引用

页码：396 / 405

页数：10

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