Thermal and mechanical cracking in bis(triisopropylsilylethnyl)pentacene thin films (vol 44, pg 3631, 2006)

被引:6
作者
Chen, Jihua [1 ]
Tee, Chee Keong [2 ]
Yang, Junyan [3 ]
Shaw, Charles [1 ]
Shtein, Max [3 ]
Martin, David C. [1 ,3 ,4 ]
Anthony, John [5 ]
机构
[1] Univ Michigan, Ctr Macromol Sci & Engn, Ann Arbor, MI 48109 USA
[2] Univ Michigan, Dept Elect Engn & Comp Sci, Ann Arbor, MI 48109 USA
[3] Univ Michigan, Dept Mat Sci & Engn, Ann Arbor, MI 48109 USA
[4] Univ Michigan, Dept Biomed Engn, Ann Arbor, MI 48109 USA
[5] Univ Kentucky, Dept Chem, Lexington, KY 40506 USA
关键词
D O I
10.1002/polb.21518
中图分类号
O63 [高分子化学(高聚物)];
学科分类号
070305 ; 080501 ; 081704 ;
摘要
引用
收藏
页码:1878 / 1878
页数:1
相关论文
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[1]   Thermal and mechanical cracking in bis(triisopropylsilyiethnyl) pentacene thin films [J].
Chen, Jihua ;
Tee, Chee Keong ;
Yang, Junyan ;
Shaw, Charles ;
Shtein, Max ;
Anthony, John ;
Martin, David C. .
JOURNAL OF POLYMER SCIENCE PART B-POLYMER PHYSICS, 2006, 44 (24) :3631-3641