Physical model for the power-law voltage and current acceleration of TDDB

被引:16
作者
Haggag, A [1 ]
Liu, N [1 ]
Menke, D [1 ]
Moosa, M [1 ]
机构
[1] Freescale Semicond Inc, Austin, TX 78721 USA
关键词
D O I
10.1016/j.microrel.2005.03.011
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
As gate voltages scale in ultra-thin gate oxide CMOS and single carrier energy drops below the threshold required for defect generation, we postulate that multiple carrier induced defect generation becomes the dominant degradation mechanism resulting in a power-law voltage and local current acceleration of time-dependent dielectric breakdown (TDDB). Data from multiple technology nodes is presented to corroborate our hypothesis, which is also demonstrated to be consistent with literature reports from several different companies. To the best of our knowledge, this is the first time the power-law local gate current acceleration is proposed in contrast to earlier formulations based on total gate current. (c) 2005 Published by Elsevier Ltd.
引用
收藏
页码:1855 / 1860
页数:6
相关论文
共 19 条
[1]   A phenomenological theory of correlated multiple soft-breakdown events in ultra-thin gate dielectrics [J].
Alam, MA ;
Smith, RK .
41ST ANNUAL PROCEEDINGS: INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM, 2003, :406-411
[2]   Scaling the gate dielectric: Materials, integration, and reliability [J].
Buchanan, DA .
IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 1999, 43 (03) :245-264
[3]  
BUDDE M, 2001, PHYS REV LETT, P14
[4]   Explanation of stress-induced damage in thin oxides [J].
Bude, JD ;
Weir, BE ;
Silverman, PJ .
INTERNATIONAL ELECTRON DEVICES MEETING 1998 - TECHNICAL DIGEST, 1998, :179-182
[5]   Anode hole injection, defect generation, and breakdown in ultrathin silicon dioxide films [J].
DiMaria, DJ ;
Stathis, JH .
JOURNAL OF APPLIED PHYSICS, 2001, 89 (09) :5015-5024
[6]   Reliability response of plasma nitrided gate dielectrics to physical and electrical CET-Scaling [J].
Geilenkeuser, R ;
Wieczorek, K ;
Mantei, T ;
Graetsch, F ;
Herrmann, L ;
Weidner, JO .
2004 IEEE INTERNATIONAL INTEGRATED RELIABILITY WORKSHOP FINAL REPORT, 2004, :15-18
[7]   High-performance chip reliability from short-time-tests - Statistical models for optical interconnect and HCI/TDDB/NBTI deep-submicron transistor failures [J].
Haggag, A ;
McMahon, W ;
Hess, K ;
Cheng, K ;
Lee, J ;
Lyding, J .
39TH ANNUAL PROCEEDINGS: INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM 2001, 2001, :271-279
[8]   What can electron paramagnetic resonance tell us about the Si/SiO2 system? [J].
Lenahan, PM ;
Conley, JF .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 1998, 16 (04) :2134-2153
[9]   Reliability scaling issues for nanoscale devices [J].
McMahon, W ;
Haggag, A ;
Hess, K .
IEEE TRANSACTIONS ON NANOTECHNOLOGY, 2003, 2 (01) :33-38
[10]  
Nicollian P. E., 2000, IEEE INT REL PHYS S, P7