GaN and related materials for device applications

被引:42
作者
Pearton, SJ [1 ]
Kuo, CP [1 ]
机构
[1] HEWLETT PACKARD CORP,DIV OPTOELECT,SAN JOSE,CA 95131
关键词
D O I
10.1557/S0883769400032516
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
引用
收藏
页码:17 / 21
页数:5
相关论文
共 24 条
[1]   ELECTRICAL AND STRUCTURAL-PROPERTIES OF INXGA1-XN ON GAAS [J].
ABERNATHY, CR ;
MACKENZIE, JD ;
BHARATAN, SR ;
JONES, KS ;
PEARTON, SJ .
APPLIED PHYSICS LETTERS, 1995, 66 (13) :1632-1634
[2]   P-TYPE CONDUCTION IN MG-DOPED GAN TREATED WITH LOW-ENERGY ELECTRON-BEAM IRRADIATION (LEEBI) [J].
AMANO, H ;
KITO, M ;
HIRAMATSU, K ;
AKASAKI, I .
JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS & EXPRESS LETTERS, 1989, 28 (12) :L2112-L2114
[3]  
CARTER CH, 1994, MAT RES SOC S P, V339
[4]   Status of silicon carbide (SiC) as a wide-bandgap semiconductor for high-temperature applications: A review [J].
Casady, JB ;
Johnson, RW .
SOLID-STATE ELECTRONICS, 1996, 39 (10) :1409-1422
[5]  
CHU SNG, 1996, MATER RES SOC S P, V421, P276
[6]   LEDS CHALLENGE THE INCANDESCENTS [J].
CRAFORD, MG .
IEEE CIRCUITS AND DEVICES MAGAZINE, 1992, 8 (05) :24-29
[7]  
CRAFORD MG, 1995, COMP SEMICOND MAG, V1, P48
[8]  
GILLIS HP, 1996, J MATER AUG, P50
[9]  
Katz Amrom H., COMMUNICATION
[10]  
MARUSKA HP, COMMUNICATION