Managing heat for electronics

被引：233

作者：

Schelling, Patrick K. ^{[1
,2
]}

Shi, Li ^{[3
,4
]}

Goodson, Kenneth E. ^{[5
]}

机构：

[1] Univ Cent Florida, Adv Mat Proc & Anal Ctr, Orlando, FL 32816 USA

[2] Univ Cent Florida, Dept Phys, Orlando, FL 32816 USA

[3] Univ Texas Austin, Dept Mech Engn, Austin, TX 78712 USA

[4] Univ Texas Austin, Ctr Nano & Mol Sci & Technol, Texas Mat Inst, Austin, TX 78712 USA

[5] Stanford Univ, Dept Mech Engn, Stanford, CA 94305 USA

来源：

MATERIALS TODAY | 2005年 / 8卷 / 06期

基金：

美国国家科学基金会;

关键词：

D O I：

10.1016/S1369-7021(05)70935-4

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Increasing power densities and decreasing transistor dimensions are hallmarks of modern computer chips. Both trends are increasing the thermal management challenge within the chip and surrounding packaging, as well as accelerating research progress on high-conductivity materials. This article reviews recent materials advances with a focus on novel composite substrates and interface materials, including those composites leveraging the high conductivities of carbon nanotubes. Furthermore, attention is given to the special properties of one-dimensional structures that are likely to be of increasing importance in future applications.

引用

页码：30 / 35

页数：6

共 34 条

[1] Computational studies of nanoscale phonon transport and interfacial scattering [J].

Becker, B ;

Schelling, PK ;

Phillpot, SR .

PHYSICA STATUS SOLIDI C: CURRENT TOPICS IN SOLID STATE PHYSICS, VOL. 1, NO. 11, 2004, 1 (11) :2955-2958

[2] Unusually high thermal conductivity of carbon nanotubes [J].

Berber, S ;

Kwon, YK ;

Tománek, D .

PHYSICAL REVIEW LETTERS, 2000, 84 (20) :4613-4616

[3] Nanoscale thermal transport [J].

Cahill, DG ;

Ford, WK ;

Goodson, KE ;

Mahan, GD ;

Majumdar, A ;

Maris, HJ ;

Merlin, R ;

Phillpot, SR .

JOURNAL OF APPLIED PHYSICS, 2003, 93 (02) :793-818

[4] Thermal conductivity of carbon nanotubes [J].

Che, JW ;

Çagin, T ;

Goddard, WA .

NANOTECHNOLOGY, 2000, 11 (02) :65-69

[5] Heat transfer in nanostructures for solid-state energy conversion [J].

Chen, G ;

Shakouri, A .

JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME, 2002, 124 (02) :242-252

[6]

Dresselhaus M. S., 1996, SCI FULLERENES CARBO

[7] Heat conduction in novel electronic films [J].

Goodson, KE ;

Ju, YS .

ANNUAL REVIEW OF MATERIALS SCIENCE, 1999, 29 :261-293

[8]

GRAEBNER JE, 1993, DIAMONDS FILMS TECHN, V4, P77

[9]

Hanrath T., 2003, PROC ASME SUMMER HEA, P1

[10] Electrical and thermal transport properties of magnetically aligned single walt carbon nanotube films [J].

Hone, J ;

Llaguno, MC ;

Nemes, NM ;

Johnson, AT ;

Fischer, JE ;

Walters, DA ;

Casavant, MJ ;

Schmidt, J ;

Smalley, RE .

APPLIED PHYSICS LETTERS, 2000, 77 (05) :666-668

← 1 2 3 4 →