Thickness and grain size dependent mechanical properties of Cu films studied by nanoindentation tests

被引：41

作者：

Cao, Z. H. ^{[1
,2
]}

Li, P. Y. ^{[1
,2
]}

Lu, H. M. ^{[1
,2
]}

Huang, Y. L. ^{[3
]}

Meng, X. K. ^{[1
,2
]}

机构：

[1] Nanjing Univ, Natl Lab Solid State Microstruct, Nanjing 210093, Peoples R China

[2] Nanjing Univ, Dept Mat Sci & Engn, Nanjing 210093, Peoples R China

[3] Xiangtan Univ, Fac Mat & Photoelect Phys, Xiangtan 411105, Peoples R China

来源：

JOURNAL OF PHYSICS D-APPLIED PHYSICS | 2009年 / 42卷 / 06期

关键词：

THIN COPPER-FILMS; DEFORMATION-BEHAVIOR; PLASTICITY SIZE; YIELD STRENGTH; INDENTATION; STRESS; ELASTICITY; SUBSTRATE; DISCRETE; HARDNESS;

D O I：

10.1088/0022-3727/42/6/065405

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

The hardness and the elastic modulus of Cu films with thickness (t) and grain size (d) have been investigated by nanoindentation tests. The d and the indentation depth increase linearly with the increase in t. The hardness rises with the decrease in t, whereas the elastic modulus is independent of t and it is about 20% less than conventional coarse-grained Cu. The enhanced hardness is attributed to the smaller d and the indentation depth. The analysis of load-displacement curves indicates that the scope of the critical shear stress for different thick Cu films ranges from 3.2 to 4.1 GPa, which is similar to the theoretical shear stress of single crystalline Cu. The present results are explained by the dislocation mediated mechanism even if d reaches about 16.4 nm for the Cu film with t = 180 nm.

引用

页数：6

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