Accurate high speed empirically based predictive modeling of deeply embedded gridded parallel plate capacitors fabricated in a multilayer LTCC process

被引：15

作者：

Poddar, R ^{[1
]}

Brooke, MA

机构：

[1] Integrated Device Technol Inc, Duluth, GA 30097 USA

[2] Georgia Inst Technol, Atlanta, GA 30332 USA

来源：

IEEE TRANSACTIONS ON ADVANCED PACKAGING | 1999年 / 22卷 / 01期

基金：

美国国家科学基金会;

关键词：

capacitor; circuit models; gridded plane; low temperature cofired ceramic; LTCC; predictive modeling; S-parameters;

D O I：

10.1109/6040.746539

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

A novel-technique is presented for the accurate, rapid, high frequency, predictive modeling of parallel plate capacitors with gridded plates manufactured in a multilayer low: temperature cofired ceramic (LTCC) process. The method is, empirical in nature and is based on the concept of incrementally constructing the-model for a structure from :well characterized individual building blocks. Building blocks are characterized by the use of test structures and measurements, and are modeled using:passive lumped circuit elements. This method is applied to the predictive modeling of deeply embedded gridded parallel plate capacitor :structures. The procedure has been experimentally verified, with accurate predictions of behavior. obtained up to the second self resonance for large ar;ea:gridded parallel plate capacitors. Since lumped, element circuits are generated by this method, structure prediction speed is determined by circuit size and simulator small signal analysis time. The method is versatile and is well suited for circuit design applications.

引用

页码：26 / 31

页数：6

共 13 条

[1]

Bailey A, 1997, IEEE MTT-S, P999, DOI 10.1109/MWSYM.1997.602970

[2]

Brown R. L., 1993, Proceedings. International Conference and Exhibition. Multichip Modules (SPIE Proc. vol.1986), P287

[3]

GIPPRICH J, 1995, IEEE MTT-S, P1583, DOI 10.1109/MWSYM.1995.406278

[4] 3-DIMENSIONAL INTERCONNECT ANALYSIS USING PARTIAL ELEMENT EQUIVALENT-CIRCUITS [J].

HEEB, H ;

RUEHLI, AE .

IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I-FUNDAMENTAL THEORY AND APPLICATIONS, 1992, 39 (11) :974-982

[5]

NAISHADHAM K, 1994, INT J MICROWAVE MILL, V4, P148

[6]

Nakatani A., 1989, IEEE 1989 MTT-S International Microwave Symposium Digest (Cat. No.89CH2725-0), P1139, DOI 10.1109/MWSYM.1989.38924

[7]

PODDAR R, IN PRESS IEEE T ADV

[8]

PODDAR R, 1998, THESIS GEORGIA I TEC

[9]

Press W. H., 1994, NUMERICAL RECIPES C

[10] EQUIVALENT CIRCUIT MODELS FOR 3-DIMENSIONAL MULTICONDUCTOR SYSTEMS [J].

RUEHLI, AE .

IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 1974, TT22 (03) :216-221

← 1 2 →