Effects of saccharin and thiourea on sulfur inclusion and coercivity of electroplated soft magnetic CoNiFe film

被引:117
作者
Osaka, T [1 ]
Sawaguchi, T
Mizutani, F
Yokoshima, T
Takai, M
Okinaka, Y
机构
[1] Waseda Univ, Kagami Mem Lab Mat Sci & Technol, Sch Sci & Engn, Dept Appl Chem, Tokyo 1698555, Japan
[2] Waseda Univ, Adv Res Inst Sci & Engn, Tokyo 1698555, Japan
[3] Natl Inst Biosci & Human Technol, Tsukuba, Ibaraki 3058566, Japan
关键词
D O I
10.1149/1.1392470
中图分类号
O646 [电化学、电解、磁化学];
学科分类号
081704 ;
摘要
During the course of our recent work performed to develop an electroplated CoNiFe ternary alloy with high saturation magnetic flux density and low coercivity for use in magnetic recording heads, it was observed that two common sulfur-containing additives, saccharin and thiourea, behave differently with respect to the dependence of sulfur inclusion and coercivity of the alloy film on the additive concentration in the plating bath. To understand the cause of this difference, scanning tunneling microscopy (STM) was performed, using Au(111) as the substrate, to examine the structure of the adsorbed layers of the additive molecules. The result revealed that the nature of adsorption is fundamentally different for the two different additives; i.e., the adsorption of saccharin is physical and reversible, whereas thiourea undergoes irreversible chemisorption. This finding is consistent with the known behaviors of the two additives in the electroplating of nickel. In this paper the different effects of saccharin and thiourea in the electrodeposition of CoNiFe alloy are interpreted based on the STM results and relevant information available in the literature on the electrodeposition of nickel. (C) 1999 The Electrochemical Society. S0013-4651(98)12-087-6. All rights reserved.
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页码:3295 / 3299
页数:5
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