Reconfigurable liquid metal circuits by Laplace pressure shaping

被引：91

作者：

Cumby, Brad L. ^{[1
]}

Hayes, Gerard J. ^{[2
]}

Dickey, Michael D. ^{[2
]}

Justice, Ryan S. ^{[3
]}

Tabor, Christopher E. ^{[3
]}

Heikenfeld, Jason C. ^{[1
]}

机构：

[1] Univ Cincinnati, Sch Elect & Comp Syst, Cincinnati, OH 45221 USA

[2] N Carolina State Univ, Dept Chem & Biomol Engn, Raleigh, NC 27695 USA

[3] USAF, Res Lab, Mat & Mfg Directorate, Wright Patterson AFB, OH 45433 USA

来源：

APPLIED PHYSICS LETTERS | 2012年 / 101卷 / 17期

基金：

美国国家科学基金会;

关键词：

TEMPERATURE;

D O I：

10.1063/1.4764020

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

We report reconfigurable circuits formed by liquid metal shaping with <10 pounds per square inch (psi) Laplace and vacuum pressures. Laplace pressure drives liquid metals into microreplicated trenches, and upon release of vacuum, the liquid metal dewets into droplets that are compacted to 10-100 x less area than when in the channel. Experimental validation includes measurements of actuation speeds exceeding 30 cm/s, simple erasable resistive networks, and switchable 4.5 GHz antennas. Such capability may be of value for next generation of simple electronic switches, tunable antennas, adaptive reflectors, and switchable metamaterials. (C) 2012 American Institute of Physics. [http://dx.doi.org/10.1063/1.4764020]

引用

页数：5

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