Effects of radiation and charge trapping on the reliability of high-κ gate dielectrics

被引:101
作者
Felix, JA
Schwank, JR
Fleetwood, DM
Shaneyfelt, MR
Gusev, EP
机构
[1] Vanderbilt Univ, Dept Elect Engn & Comp Sci, Nashville, TN 37235 USA
[2] IBM Corp, Thomas J Watson Res Ctr, Semicond Res & Dev Ctr, Yorktown Hts, NY 10598 USA
[3] Sandia Natl Labs, Albuquerque, NM 87185 USA
关键词
D O I
10.1016/j.microrel.2003.12.005
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The radiation response and long term reliability of alternative gate dielectrics will play a critical role in determining the viability of these materials for use in future space applications. The total dose radiation responses of several near and long term alternative gate dielectrics to SiO2 are discussed. Radiation results are presented for nitrided oxides, which show no change in interface trap density with dose and oxide trapped charge densities comparable to ultra thin thermal oxides. For aluminum oxide and hafnium oxide gate dielectric stacks, the density of oxide trapped charge is shown to depend strongly on the film thickness and processing conditions. The alternative gate dielectrics discussed here are shown to have effective trapping efficiencies that are up to similar to15 to 20 times larger than thermal SiO2 of equivalent electrical thickness. A discussion of single event effects in devices and ICs is also provided. It is shown that some alternative gate dielectrics exhibit excellent tolerance to heavy ion induced gate dielectric breakdown. However, it is not yet known how irradiation with energetic particles will affect the long term reliability of MOS devices with high-kappa gate dielectrics in a space environment. (C) 2003 Elsevier Ltd. All rights reserved.
引用
收藏
页码:563 / 575
页数:13
相关论文
共 108 条
[1]  
Alam M. A., 1999, International Electron Devices Meeting 1999. Technical Digest (Cat. No.99CH36318), P449, DOI 10.1109/IEDM.1999.824190
[2]  
[Anonymous], 2003, IEEE NSREC SHORT COU
[3]  
[Anonymous], 1993, IEEE NSREC SHORT COU
[4]   Influence of γ radiation on thin Ta2O5-Si structures [J].
Atanassova, E ;
Paskaleva, A ;
Konakova, R ;
Spassov, D ;
Mitin, VF .
MICROELECTRONICS JOURNAL, 2001, 32 (07) :553-562
[5]   GENERALIZED SCALING THEORY AND ITS APPLICATION TO A 1/4 MICROMETER MOSFET DESIGN [J].
BACCARANI, G ;
WORDEMAN, MR ;
DENNARD, RH .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1984, 31 (04) :452-462
[6]   HOLE REMOVAL IN THIN-GATE MOSFETS BY TUNNELING [J].
BENEDETTO, JM ;
BOESCH, HE ;
MCLEAN, FB ;
MIZE, JP .
IEEE TRANSACTIONS ON NUCLEAR SCIENCE, 1985, 32 (06) :3916-3920
[7]   THE RELATIONSHIP BETWEEN CO-60 AND 10-KEV X-RAY-DAMAGE IN MOS DEVICES [J].
BENEDETTO, JM ;
BOESCH, HE .
IEEE TRANSACTIONS ON NUCLEAR SCIENCE, 1986, 33 (06) :1318-1323
[8]   INTERFACE-STATE GENERATION UNDER RADIATION AND HIGH-FIELD STRESSING IN REOXIDIZED NITRIDED OXIDE MOS CAPACITORS [J].
BHAT, N ;
VASI, J .
IEEE TRANSACTIONS ON NUCLEAR SCIENCE, 1992, 39 (06) :2230-2235
[9]   SATELLITE ANOMALIES FROM GALACTIC COSMIC-RAYS [J].
BINDER, D ;
SMITH, EC ;
HOLMAN, AB .
IEEE TRANSACTIONS ON NUCLEAR SCIENCE, 1975, 22 (06) :2675-2680
[10]  
BOHR M, INTELS 90 NM TECHNOL