Morphology of nanometer-thick electrolytic copper layers investigated by atomic force microscopy

被引:13
作者
Cerisier, M [1 ]
Van Haesendonck, C
Celis, JP
机构
[1] Katholieke Univ Leuven, Dept MTM, B-3001 Louvain, Belgium
[2] Katholieke Univ Leuven, Vaste Stof Fys Magnetisme Lab, B-3001 Louvain, Belgium
关键词
D O I
10.1149/1.1391851
中图分类号
O646 [电化学、电解、磁化学];
学科分类号
081704 ;
摘要
The effect of electrolytic deposition parameters on the morphology of very thin (5 nm) copper layers was investigated by atomic force microscopy. Such thin copper layers were electrodeposited from solutions with different concentrations of copper sulfate and sulfuric acid on silicon wafers sputter-coated with a Ti layer and a Cu top layer. The characterization of these layers by atomic force microscopy shows that 5 nm thick Cu layers deposited by galvanostatic electrodeposition are homogeneous and present granular features on the surface. An increase of the copper sulfate concentration results in an increase in the size of the granular surface features. The lowest surface roughness is observed at a concentration of 100 g/L sulfuric acid. (C) 1999 The Electrochemical Society. S0013-4651(98)03-041-9. All rights reserved.
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页码:1829 / 1834
页数:6
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