Exposure parameters for MeV proton beam writing on SU-8

被引:13
作者
Auzelyte, Vaida [1 ]
Elfrnan, Mikael [1 ]
Kristiansson, Per [1 ]
Nilsson, Christer [1 ]
Pallon, Jan [1 ]
Marrero, Natalia Arteaga [1 ]
Wegden, Marie [1 ]
机构
[1] Lund Inst Technol, Dept Nucl Phys, SE-22100 Lund, Sweden
关键词
microfabrication; proton beam writing; lithography; exposure latitude; aspect ratio; pattern density;
D O I
10.1016/j.mee.2006.04.001
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Proton beam writing was performed on a lithographic resist to determine the main parameters required to achieve the minimum feature size, maximum pattern lateral density and maximum aspect ratio. A 2.5 MeV proton beam focused to sizes between 1.5 and 2.5 mu m was used to expose SU-8 negative resist. The number of protons per pixel was varied in the exposure of SU-8 with thicknesses between 5 and 95 pm. Patterns consisting of single pixels, single-pixel lines and multi-pixel areas with different densities were fabricated. The smallest structures achieved were posts 1.5 pin in diameter with 4:1 structure-space ratio in 15 pm thick resist and the highest aspect ratio structures of 20:1 in 40 pm resist were produced. It was found that the minimum feature size depended only on the beam size, and +/- 10% post size accuracy could be achieved within 40-70% variation of the number of protons. MeV proton beam allows a direct fabrication of complex shapes without a mask in single-step irradiation and. in addition, no proximity correction is needed. We present examples of MeV proton beam written single and multi-pixel microstructures with easily reproducible high aspect ratios and densities. (c) 2006 Elsevier B.V. All rights reserved.
引用
收藏
页码:2015 / 2020
页数:6
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