Localization of weak heat sources in electronic devices using highly sensitive lock-in thermography

被引：37

作者：

Rakotoniaina, JP ^{[1
]}

Breitenstein, O ^{[1
]}

Langenkamp, M ^{[1
]}

机构：

[1] Max Planck Inst Mikrostrukturphys, D-06120 Halle Saale, Germany

来源：

MATERIALS SCIENCE AND ENGINEERING B-SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGY | 2002年 / 91卷

关键词：

solar cells; IC testing; thermography;

D O I：

10.1016/S0921-5107(01)01011-X

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Using lock-in thermography the temperature resolution of a Focal Plane Array (FPA) thermocamera can be improved down to 40 muK after 1000 s measuring time. This allows the detection of even weak heat sources (hot spots) in electronic devices. The technical realization of lock-in thermography is described here with typical applications to the investigations of shunts in solar cells and localization of local heat sources in ICs. Because of its high spatial resolution, its high thermal sensivity as well as its simplicity, this technique is an advantageous alternative to usual thermal testing in electronic devices. (C) 2002 Elsevier Science B.V. All rights reserved.

引用

页码：481 / 485

页数：5

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