Photoelectrochemical undercut etching for fabrication of GaN microelectromechanical systems

被引:40
作者
Stonas, AR [1 ]
MacDonald, NC
Turner, KL
DenBaars, SP
Hu, EL
机构
[1] Univ Calif Santa Barbara, Dept Elect & Comp Engn, Santa Barbara, CA 93106 USA
[2] Univ Calif Santa Barbara, Dept Mech Engn, Santa Barbara, CA 93106 USA
[3] Univ Calif Santa Barbara, Dept Mat, Santa Barbara, CA 93106 USA
来源
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B | 2001年 / 19卷 / 06期
关键词
D O I
10.1116/1.1415508
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The authors have developed a wet, band-gap-selective, photoelectrochemical etching process capable of producing cantilever microelectromechanical systems from InGaN/GaN heterostructures. Fabricated cantilevers were successfully actuated, and resonance spectra were measured. The as-grown strain gradient in the GaN film was found to relax upon removal, resulting in upward curvature of the cantilevers. This curvature was shown to be reversible with the integration of strained InGaN layers on the top surface of the cantilever. All photoelectrochemical wet etching was conducted using a benchtop lamp-and-filter arrangement, employing GaN and InGaN films as filters. (C) 2001 American Vacuum Society.
引用
收藏
页码:2838 / 2841
页数:4
相关论文
共 9 条
[1]   Plasma etch-induced conduction changes in gallium nitride [J].
Eddy, CR ;
Molnar, B .
JOURNAL OF ELECTRONIC MATERIALS, 1999, 28 (03) :314-318
[2]   Room-temperature photoenhanced wet etching of GaN [J].
Minsky, MS ;
White, M ;
Hu, EL .
APPLIED PHYSICS LETTERS, 1996, 68 (11) :1531-1533
[3]  
Shul R. J., 1996, Proceedings of the Symposium on High Speed III-V Electronics for Wireless Applications and the Twenty-Fifth State-of-the-Art Program on Compound Semiconductors (SOTAPOCS XXV), P232
[4]   Comparison of plasma etch techniques for III-V nitrides [J].
Shul, RJ ;
Vawter, GA ;
Willison, CG ;
Bridges, MM ;
Lee, JW ;
Pearton, SJ ;
Abernathy, CR .
SOLID-STATE ELECTRONICS, 1998, 42 (12) :2259-2267
[5]   Backside-illuminated photoelectrochemical etching for the fabrication of deeply undercut GaN structures [J].
Stonas, AR ;
Kozodoy, P ;
Marchand, H ;
Fini, P ;
DenBaars, SP ;
Mishra, UK ;
Hu, EL .
APPLIED PHYSICS LETTERS, 2000, 77 (16) :2610-2612
[6]   Development of selective lateral photoelectrochemical etching of InGaN/GaN for lift-off applications [J].
Stonas, AR ;
Margalith, T ;
DenBaars, SP ;
Coldren, LA ;
Hu, EL .
APPLIED PHYSICS LETTERS, 2001, 78 (13) :1945-1947
[7]   Highly anisotropic photoenhanced wet etching of n-type GaN [J].
Youtsey, C ;
Adesida, I ;
Bulman, G .
APPLIED PHYSICS LETTERS, 1997, 71 (15) :2151-2153
[8]   Gallium nitride whiskers formed by selective photoenhanced wet etching of dislocations [J].
Youtsey, C ;
Romano, LT ;
Adesida, I .
APPLIED PHYSICS LETTERS, 1998, 73 (06) :797-799
[9]   Smooth n-type GaN surfaces by photoenhanced wet etching [J].
Youtsey, C ;
Adesida, I ;
Romano, LT ;
Bulman, G .
APPLIED PHYSICS LETTERS, 1998, 72 (05) :560-562