A counting pixel chip and sensor system for X-ray imaging

被引：14

作者：

Fischer, P

Hausmann, J

Helmich, A

Lindner, M

Wermes, N

Blanquart, L

机构：

[1] Univ Bonn, Inst Phys, D-53115 Bonn, Germany

[2] CNRS, IN2P3, Ctr Phys Particules, F-13288 Marseille 9, France

来源：

IEEE TRANSACTIONS ON NUCLEAR SCIENCE | 1999年 / 46卷 / 04期

关键词：

D O I：

10.1109/23.790828

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Results obtained with a (photon) counting pixel imaging chip connected to a silicon pixel sensor using the bump and flip-chip technology are presented. The performance of the chip electronics is characterized by an average equivalent noise charge (ENC) below 135 e and a threshold spread of less than 35 e after individual threshold adjust, both measured with a sensor attached. First results on the imaging performance are also reported.

引用

页码：1070 / 1074

页数：5

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