Design considerations and experimental analysis for silicon carbide power rectifiers

被引:69
作者
Khemka, V [1 ]
Patel, R [1 ]
Chow, TP [1 ]
Gutmann, RJ [1 ]
机构
[1] Rensselaer Polytech Inst, Ctr Integrated Elect & Elect Mfg, Troy, NY 12180 USA
关键词
D O I
10.1016/S0038-1101(99)00155-0
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In this paper we present the investigation of properties of silicon carbide power rectifiers, in particular Schottky, PiN and advanced hybrid power rectifiers such as the trench MOS barrier Schottky rectifier. Analysis of the forward, reverse and switching experimental characteristics are presented and these silicon carbide rectifiers are compared to silicon devices. Silicon carbide Schottky rectifiers are attractive for applications requiring blocking voltage in excess of 100 V as the use of Si is precluded by its large specific on-resistance. Analysis of power dissipation indicates that silicon carbide Schottky rectifiers offer significant improvement over silicon counterparts. Silicon carbide junction rectifiers, on the other hand, are superior to silicon counterparts only for blocking voltage greater than 2000 V. Performance of acceptor (boron) and donor (phosphorus) implanted experimental silicon carbide junction rectifiers are presented and compared. Some of the recent developments in silicon carbide rectifiers have been described and compared with theory and our experimental results. The well established silicon rectifiers theory are often inadequate to describe the characteristics of the experimental silicon carbide junction rectifiers and appropriate generalization of these theories are presented. Experimental trench MOS barrier Schottky rectifiers (TMBS) have demonstrated significant improvement in leakage current compared to planar Schottky devices. Performance of current state-of-the-art silicon carbide rectifiers are far from theoretical predictions. Availability of high-quality silicon carbide crystals is crucial to successful realization of these performance projections. (C) 1999 Elsevier Science Ltd. All rights reserved.
引用
收藏
页码:1945 / 1962
页数:18
相关论文
共 48 条
[1]  
ALOK D, 1997, P INT C SIC 3 N REL, P929
[2]  
ANIKIN MM, 1989, SOV PHYS SEMICOND+, V23, P405
[3]  
ANIKIN MM, 1989, SOV PHYS SEMICOND+, V23, P1122
[4]   THE PINCH RECTIFIER - A LOW-FORWARD-DROP HIGH-SPEED POWER DIODE [J].
BALIGA, BJ .
IEEE ELECTRON DEVICE LETTERS, 1984, 5 (06) :194-196
[5]   POWER SEMICONDUCTOR-DEVICE FIGURE OF MERIT FOR HIGH-FREQUENCY APPLICATIONS [J].
BALIGA, BJ .
IEEE ELECTRON DEVICE LETTERS, 1989, 10 (10) :455-457
[6]  
BALIGA BJ, 1987, IEDM, P658
[7]  
BALIGA BJ, 1994, MODERN POWER DEVICES
[8]  
Bhalla A., 1993, P 5 INT PHYS C, V137, P621
[9]   Effect of surface inhomogeneities on the electrical characteristics of SiC Schottky contacts [J].
Bhatnagar, M ;
Baliga, BJ ;
Kirk, HR ;
Rozgonyi, GA .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1996, 43 (01) :150-156
[10]   Dopant activation and surface morphology of ion implanted 4H and 6H silicon carbide [J].
Capano, MA ;
Ryu, S ;
Melloch, MR ;
Cooper, JA ;
Buss, MR .
JOURNAL OF ELECTRONIC MATERIALS, 1998, 27 (04) :370-376