Microstructural characterization of damage in thermomechanically fatigued Sn-Ag based solder joints

被引：43

作者：

Choi, S ^{[1
]}

Lee, JG ^{[1
]}

Subramanian, KN ^{[1
]}

Lucas, JP ^{[1
]}

Bieler, TR ^{[1
]}

机构：

[1] Michigan State Univ, Dept Chem Engn & Mat Sci, E Lansing, MI 48824 USA

来源：

JOURNAL OF ELECTRONIC MATERIALS | 2002年 / 31卷 / 04期

基金：

美国国家科学基金会;

关键词：

thermomechanical fatigue; lead-free solder; eutectic Sn-Ag solder; damage characterization;

D O I：

10.1007/s11664-002-0146-z

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Sn-Ag based solder joints of 100-mum thickness were thermomechanically fatigued between -15degreesC and +150degreesC with a ramp rate of 25degreesC/min for the heating segment and 7degreesC/min for the cooling segment. The hold times were 20 min at high temperature extreme and 300 min at the low temperature extreme. Surface damage accumulation predominantly consisted of shear banding, surface relief due to Sn-grain extrusion, grain boundary sliding, and grain decohesion usually near the solder/substrate interface. Small alloy additions were found to affect the extent of this surface damage accumulation.

引用

页码：292 / 297

页数：6

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