Creep properties of Sn-Ag solder joints containing intermetallic particles

被引：53

作者：

Choi, S ^{[1
]}

Lee, JG ^{[1
]}

Guo, F ^{[1
]}

Bieler, TR ^{[1
]}

Subramanian, KN ^{[1
]}

Lucas, JP ^{[1
]}

机构：

[1] Michigan State Univ, Dept Mech & Mat Sci, E Lansing, MI 48824 USA

来源：

JOM-JOURNAL OF THE MINERALS METALS & MATERIALS SOCIETY | 2001年 / 53卷 / 06期

基金：

美国国家科学基金会;

关键词：

D O I：

10.1007/s11837-001-0098-4

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The creep behavior of the eutectic tin-silver joints and tin-silver composite solder joints containing 20 vol.% of Cu6Sn5, Ni3Sn4 and FeSn2 intermetallic reinforcements introduced by in-situ methods was investigated. These creep tests were carried out using single shear lap solder joints at room temperature, 85 degreesC, and 125 degreesC. The creep resistance was similar in magnitude for all alloys, and with increasing temperature, the stress exponents decreased in a manner consistent with power-law breakdown behavior. The FeSn2 intermetallic reinforced composite solder was found to be the most creep-resistant alloy at room temperature. Creep failure was observed to occur within the solder matrix in all these solder joints. Although a detailed analysis of the processes involved was difficult because of smearing of the features in the fracture surface, there were indications of grain-boundary separation, ductile fracture, and interfacial separation.

引用

页码：22 / 26

页数：5

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