The mechanical behavior of interconnect materials for electronic packaging

被引：82

作者：

Frear, DR

机构：

[1] University of California, Berkeley, CA

[2] Sandia National Laboratories, M.S. 1411, Albuquerque, NM 87185

来源：

JOM-JOURNAL OF THE MINERALS METALS & MATERIALS SOCIETY | 1996年 / 48卷 / 05期

关键词：

D O I：

10.1007/BF03222944

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

A variety of new materials are needed for solder interconnects in electronic packages for high- and low-temperature applications. This article compares the mechanical behavior of low-temperature materials (Sn-40In-20Pb, Sn-58Bi, and a silver-loaded conductive adhesive) and high-melting-temperature solders (Sn-3.5Ag, Sn-3.4Ag-4.8Bi, and Sn-4.7Ag-1.7 Cu) to near-eutectic Sn-40Pb solder. The results indicate that there are promising materials alternatives to the traditional Sn-Pb solders in electronic interconnect applications.

引用

页码：49 / 53

页数：5

共 13 条

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