Upregulation of the Hsp104 chaperone at physiological temperature during recovery from thermal insult

被引:16
作者
Seppä, L
Hänninen, AL
Makarow, M
机构
[1] Univ Helsinki, Inst Biotechnol, Program Cellular Biotechnol, Helsinki 00710, Finland
[2] Univ Helsinki, Dept Appl Chem & Microbiol, Helsinki 00710, Finland
关键词
D O I
10.1111/j.1365-2958.2003.03959.x
中图分类号
Q5 [生物化学]; Q7 [分子生物学];
学科分类号
071010 ; 081704 ;
摘要
Thermal insult at 50degreesC causes protein denaturation in yeast, but the cells survive if preconditioned at 37degreesC. Survival depends on refolding of heat-denatured proteins. Refolding of cytoplasmic proteins requires Hsp104, the expression of which increases several-fold upon shift of the cells from physiological temperature 24degreesC to 37degreesC. We describe here a novel type of regulation of Hsp104, designated delayed upregulation (DUR). When Saccharomyces cerevisiae cells grown at 24degreesC, preconditioned at 37degreesC and treated briefly at 50degreesC were shifted back to 24degreesC, Hsp104 expression was negligible for 1 h, but increased then to a three to nine times higher level than that detected after growth at 24degreesC, returning to normal after 5 h. A heat shock element (HSE) of the upstream sequence of HSP104 was necessary and sufficient for DUR, whereas stress response elements (STRE) were dispensable. Destruction of HSE plus all three STREs abolished Hsp104 expression, resulting in cell death after thermal insult. Deletion of MSN2/4, encoding transcription factors driving STRE-dependent gene expression, decreased DUR. Deletion of HOG1, encoding a heat-responsive and osmosensitive mitogen-activated protein kinase implicated to be functionally connected to Msn2/4p, abolished DUR. We suggest that DUR was regulated via HSE, required Hog1p and involved Msn2/4p-regulated gene products.
引用
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页码:217 / 225
页数:9
相关论文
共 31 条
  • [1] Stress-induced MAP kinase Hog1 is part of transcription activation complexes
    Alepuz, PM
    Jovanovic, A
    Reiser, V
    Ammerer, G
    [J]. MOLECULAR CELL, 2001, 7 (04) : 767 - 777
  • [2] CMV infection of liver transplant recipients: comparison of antigenemia and molecular biology assays
    Amorim, ML
    Cabeda, JM
    Seca, R
    Mendes, AC
    Castro, AP
    Amorim, JM
    [J]. BMC INFECTIOUS DISEASES, 2001, 1 (1)
  • [3] Osmotic stress causes a G1 cell cycle delay and downregulation of Cln3/Cdc28 activity in Saccharomyces cerevisiae
    Belli, G
    Garí, E
    Aldea, M
    Herrero, E
    [J]. MOLECULAR MICROBIOLOGY, 2001, 39 (04) : 1022 - 1035
  • [4] A FAMILY OF LOW AND HIGH COPY REPLICATIVE, INTEGRATIVE AND SINGLE-STRANDED SACCHAROMYCES-CEREVISIAE ESCHERICHIA-COLI SHUTTLE VECTORS
    BONNEAUD, N
    OZIERKALOGEROPOULOS, O
    LI, GY
    LABOUESSE, M
    MINVIELLESEBASTIA, L
    LACROUTE, F
    [J]. YEAST, 1991, 7 (06) : 609 - 615
  • [5] The heat shock response in yeast: differential regulations and contributions of the Msn2p/Msn4p and Hsf1p regulons
    Boy-Marcotte, E
    Lagniel, G
    Perrot, M
    Bussereau, F
    Boudsocq, A
    Jacquet, M
    Labarre, J
    [J]. MOLECULAR MICROBIOLOGY, 1999, 33 (02) : 274 - 283
  • [6] Degols G, 1996, MOL CELL BIOL, V16, P2870
  • [7] Genomic expression programs in the response of yeast cells to environmental changes
    Gasch, AP
    Spellman, PT
    Kao, CM
    Carmel-Harel, O
    Eisen, MB
    Storz, G
    Botstein, D
    Brown, PO
    [J]. MOLECULAR BIOLOGY OF THE CELL, 2000, 11 (12) : 4241 - 4257
  • [8] HSF and Msn2/4p can exclusively or cooperatively activate the yeast HSP104 gene
    Grably, MR
    Stanhill, A
    Tell, O
    Engelberg, D
    [J]. MOLECULAR MICROBIOLOGY, 2002, 44 (01) : 21 - 35
  • [9] The cytoplasmic chaperone Hsp104 is required for conformational repair of heat-denatured proteins in the yeast endoplasmic reticulum
    Hänninen, AL
    Simola, M
    Saris, N
    Makarow, M
    [J]. MOLECULAR BIOLOGY OF THE CELL, 1999, 10 (11) : 3623 - 3632
  • [10] CONSTITUTIVE BINDING OF YEAST HEAT-SHOCK FACTOR TO DNA INVIVO
    JAKOBSEN, BK
    PELHAM, HRB
    [J]. MOLECULAR AND CELLULAR BIOLOGY, 1988, 8 (11) : 5040 - 5042