High voltage (450 V) 6H-SIC lateral MESFET structure

被引:5
作者
Alok, D
Baliga, BJ
机构
[1] Power Semiconductor Research Center, North Carolina State University, Raleigh
关键词
MESFET; silicon carbide;
D O I
10.1049/el:19961287
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A high voltage 6H-SiC lateral MESFET has been fabricated using a three mask process. Selective ion implantation was used to create the conducting layer (N-region) demonstrating the RESURF effect in SiC for first time, as well as easy isolation and edge termination. This MESFET was able to withstand a forward blocking voltage of 450 V at a gate voltage of -20 V. The specific on-resistance and transconductance for a device with a drain gate separation of 15 mu m was found to be 83 m Omega cm(2) and 2mS/mm respectively.
引用
收藏
页码:1929 / 1931
页数:3
相关论文
共 9 条
[1]  
ALOK D, 1993, IEDM, P691
[2]  
[Anonymous], 1979, IEDM
[3]   COMPARISON OF 6H-SIC, 3C-SIC, AND SI FOR POWER DEVICES [J].
BHATNAGAR, M ;
BALIGA, BJ .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1993, 40 (03) :645-655
[4]   SILICON-CARBIDE HIGH-VOLTAGE (400 V) SCHOTTKY-BARRIER DIODES [J].
BHATNAGAR, M ;
MCLARTY, PK ;
BALIGA, BJ .
IEEE ELECTRON DEVICE LETTERS, 1992, 13 (10) :501-503
[5]   HIGH-VOLTAGE POWER MOSFETS WITH A TRENCH-GATE STRUCTURE [J].
CHANG, HR ;
HOLROYD, FW .
SOLID-STATE ELECTRONICS, 1990, 33 (03) :381-386
[6]   NUMERICAL AND EXPERIMENTAL-ANALYSIS OF 500-V POWER DMOSFET WITH AN ATOMIC-LATTICE LAYOUT [J].
CHANG, HR ;
BALIGA, BJ .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1989, 36 (11) :2623-2623
[7]  
NEUDECK PG, 1994, T 2 HIGH TEMP EL C, V1, pX23
[8]  
PALMOUR JW, 1991, 1ST P INT HIGH TEMP, P511
[9]  
Stupp E. H., 1981, International Electron Devices Meeting, P426