共 399 条
Transfer Printing Techniques for Materials Assembly and Micro/Nanodevice Fabrication
被引:778
作者:
Carlson, Andrew
[2
]
Bowen, Audrey M.
[3
]
Huang, Yonggang
[1
]
Nuzzo, Ralph G.
[3
]
Rogers, John A.
[2
]
机构:
[1] Northwestern Univ, Dept Mech Engn, Dept Civil & Environm Engn, Evanston, IL 60208 USA
[2] Univ Illinois, Dept Mat Sci & Engn, Fredrick Seitz Mat Res Lab, Beckman Inst Adv Sci & Technol, Urbana, IL USA
[3] Univ Illinois, Dept Chem, Urbana, IL USA
关键词:
transfer print;
flexible electronics;
deterministic assembly;
additive transfer;
subtractive transfer;
THIN-FILM TRANSISTORS;
WALLED CARBON NANOTUBES;
LIGHT-EMITTING-DIODES;
HIGH-PERFORMANCE ELECTRONICS;
LANGMUIR-BLODGETT-FILMS;
CDSE/ZNS QUANTUM DOTS;
TREATED PDMS STAMP;
POROUS-SILICON;
LARGE-AREA;
SOFT-LITHOGRAPHY;
D O I:
10.1002/adma.201201386
中图分类号:
O6 [化学];
学科分类号:
0703 ;
摘要:
Transfer printing represents a set of techniques for deterministic assembly of micro-and nanomaterials into spatially organized, functional arrangements with two and three-dimensional layouts. Such processes provide versatile routes not only to test structures and vehicles for scientific studies but also to high-performance, heterogeneously integrated functional systems, including those in flexible electronics, three-dimensional and/or curvilinear optoelectronics, and bio-integrated sensing and therapeutic devices. This article summarizes recent advances in a variety of transfer printing techniques, ranging from the mechanics and materials aspects that govern their operation to engineering features of their use in systems with varying levels of complexity. A concluding section presents perspectives on opportunities for basic and applied research, and on emerging use of these methods in high throughput, industrial-scale manufacturing.
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页码:5284 / 5318
页数:35
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