Transfer Printing Techniques for Materials Assembly and Micro/Nanodevice Fabrication

被引:778
作者
Carlson, Andrew [2 ]
Bowen, Audrey M. [3 ]
Huang, Yonggang [1 ]
Nuzzo, Ralph G. [3 ]
Rogers, John A. [2 ]
机构
[1] Northwestern Univ, Dept Mech Engn, Dept Civil & Environm Engn, Evanston, IL 60208 USA
[2] Univ Illinois, Dept Mat Sci & Engn, Fredrick Seitz Mat Res Lab, Beckman Inst Adv Sci & Technol, Urbana, IL USA
[3] Univ Illinois, Dept Chem, Urbana, IL USA
关键词
transfer print; flexible electronics; deterministic assembly; additive transfer; subtractive transfer; THIN-FILM TRANSISTORS; WALLED CARBON NANOTUBES; LIGHT-EMITTING-DIODES; HIGH-PERFORMANCE ELECTRONICS; LANGMUIR-BLODGETT-FILMS; CDSE/ZNS QUANTUM DOTS; TREATED PDMS STAMP; POROUS-SILICON; LARGE-AREA; SOFT-LITHOGRAPHY;
D O I
10.1002/adma.201201386
中图分类号
O6 [化学];
学科分类号
0703 ;
摘要
Transfer printing represents a set of techniques for deterministic assembly of micro-and nanomaterials into spatially organized, functional arrangements with two and three-dimensional layouts. Such processes provide versatile routes not only to test structures and vehicles for scientific studies but also to high-performance, heterogeneously integrated functional systems, including those in flexible electronics, three-dimensional and/or curvilinear optoelectronics, and bio-integrated sensing and therapeutic devices. This article summarizes recent advances in a variety of transfer printing techniques, ranging from the mechanics and materials aspects that govern their operation to engineering features of their use in systems with varying levels of complexity. A concluding section presents perspectives on opportunities for basic and applied research, and on emerging use of these methods in high throughput, industrial-scale manufacturing.
引用
收藏
页码:5284 / 5318
页数:35
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