Thermal transport mechanisms at nanoscale point contacts

被引:194
作者
Shi, L [1 ]
Majumdar, A [1 ]
机构
[1] Univ Calif Berkeley, Dept Mech Engn, Berkeley, CA 94720 USA
来源
JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME | 2002年 / 124卷 / 02期
关键词
contact resistance; heat transfer; microscale; nanoscale; probes;
D O I
10.1115/1.1447939
中图分类号
O414.1 [热力学];
学科分类号
摘要
We have experimentally investigated the heat transfer mechanisms at a 90+/-10 nm diameter point contact between a sample and a probe tip of a scanning thermal microscope (SThM). For large heated regions on the sample, air conduction is the dominant tip-sample heat transfer mechanism. For micro/nano devices with a submicron localized heated region, the air conduction contribution decreases, whereas conduction through the solid-solid contact and a liquid meniscus bridging the tip-sample junction become important, resulting in the sub-100 nm spatial resolution found in the SThM images. Using a one dimensional heat transfer model, we extracted from experimental data a liquid film thermal conductance of 6.7 +/- 1.5 nW/K. Solid-solid conduction increased linearly as contact force increased, with a contact conductance of 0.76+/-0.38 W/m(2)-K-Pa, and saturated for contact forces larger than 38+/-11 nN. This is most likely due to the elastic-plastic contact between the sample and an asperity at the tip end.
引用
收藏
页码:329 / 337
页数:9
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