Advanced photolithographic mask repair using electron beams

被引:75
作者
Liang, T [1 ]
Frendberg, E [1 ]
Lieberman, B [1 ]
Stivers, A [1 ]
机构
[1] Intel Corp, Santa Clara, CA 94054 USA
来源
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B | 2005年 / 23卷 / 06期
关键词
Deposition - Electron beams - Etching - Phase shift - Photolithography - Repair;
D O I
10.1116/1.2062428
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Mask repair plays an important role in yielding advanced masks that support the lithography roadmap. It is also one of the more challenging parts of mask fabrication. Electron beam induced deposition and etching have shown great potential for mask repair applications. Our work has demonstrated that e-beam mask repair provides the superior resolution and damage-free process that is needed to support mask generations for the 32 nm technology node and beyond. This article describes an installed e-beam mask repair tool at Intel Mask Operation and discusses the capabilities of this enabling technology based on results obtained from repairing masks with "defects" intentionally inserted into the design (programmed defect masks). Specifically, results are presented for quartz etch repair of alternating phase shift masks and TaBN absorber etch of extreme ultraviolet masks, two of the most difficult types of mask to repair using conventional methods. (c) 2005 American Vacuum Society.
引用
收藏
页码:3101 / 3105
页数:5
相关论文
共 16 条
[1]  
Attwood D., 1999, SOFT XRAYS EXTREME U
[2]   Electron-beam-based photomask repair [J].
Edinger, K ;
Becht, H ;
Bihr, J ;
Boegli, V ;
Budach, M ;
Hofmann, T ;
Koops, HWP ;
Kuschnerus, P ;
Oster, J ;
Spies, P ;
Weyrauch, B .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 2004, 22 (06) :2902-2906
[3]   Application of electron-beam induced processes to mask repair [J].
Edinger, K ;
Boegli, V ;
Budach, M ;
Hoinkis, O ;
Weyrauch, B ;
Koops, HWP ;
Bihr, J ;
Greiser, J .
PHOTOMASK AND NEXT-GENERATION LITHOGRAPHY MASK TECHNOLOGY X, 2003, 5130 :383-390
[4]  
ITOU Y, 2004, P SOC PHOTO-OPT INS, V5445, P301
[5]   Development of low damage mask making process on EUV mask with thin CrN buffer layer [J].
Kureishi, M ;
Ohkubo, R ;
Hosoya, M ;
Shoki, T ;
Sakaya, N ;
Kobayashi, H ;
Nozawa, O ;
Usui, Y ;
Nagarekawa, O .
Emerging Lithographic Technologies IX, Pts 1 and 2, 2005, 5751 :158-167
[6]   E-beam mask repair: Fundamental capability and applications [J].
Liang, T ;
Frendberg, E ;
Bald, D ;
Penn, M ;
Stivers, A .
24TH ANNUAL BACUS SYMPOSIUM ON PHOTOMASK TECHNOLOGY, PT 1 AND 2, 2004, 5567 :456-466
[7]   Demonstration of damage-free mask repair using electron beam-induces processes [J].
Liang, T ;
Stivers, A ;
Penn, M ;
Bald, D ;
Sethi, C .
PHOTOMASK AND NEXT GENERATION LITHOGRAPHY MASK TECHNOLOGY XI, 2004, 5446 :291-300
[8]   Damage-free mask repair using electron beam induced chemical reactions [J].
Liang, T ;
Stivers, A .
EMERGING LITHOGRAPHIC TECHNOLOGIES VI, PTS 1 AND 2, 2002, 4688 :375-384
[9]   Enhanced optical inspectability of patterned EUVL mask [J].
Liang, T ;
Stivers, A ;
Yan, PY ;
Tejnil, E ;
Zhang, GJ .
21ST ANNUAL BACUS SYMPOSIUM ON PHOTOMASK TECHNOLOGY, PTS 1 AND 2, 2002, 4562 :288-296
[10]   Progress in extreme ultraviolet mask repair using a focused ion beam [J].
Liang, T ;
Stivers, A ;
Livengood, R ;
Yan, PY ;
Zhang, GJ ;
Lo, FC .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 2000, 18 (06) :3216-3220