Evaluation of system configurations for thermoelectric power generation

被引：5

作者：

de Bock, H. Peter J. ^{[1
]}

Novak, Vladimir ^{[2
]}

机构：

[1] GE Global Res, Thermal Syst Lab, 1 Res Circle, Niskayuna, NY USA

[2] GE Global Res, Energy Syst Lab, Niskayuna, NY USA

来源：

2008 11TH IEEE INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS, VOLS 1-3 | 2008年

关键词：

D O I：

10.1109/ITHERM.2008.4544405

中图分类号：

O414.1 [热力学];

学科分类号：

摘要：

Recent developments in thermoelectric materials have led to renewed interest in thermoelectric devices for power generation. In a system where a thermoelectric generator uses a finite heat source and sink such as fluid streams, thermodynamic characteristics of the heat source and heat sink are relevant in evaluating the conversion efficiency. Based on the system efficiency equations derived in prior work, an evaluation of a thermoelectric power generation system can be made and its performance can be expressed as a function of both thermoelectric figure of merit and thermal system performance metrics. These dependencies are presented on a performance map. Performance maps reinforce and quantify the suggestion that both thermoelectric material and thermal sciences are crucial to the performance of thermoelectric generators.

引用

页码：1276 / +

页数：2

共 12 条

[1] Alternate thermoelectric thermodynamic cycles with improved power generation efficiencies [J].

Bell, LE .

TWENTY-SECOND INTERNATIONAL CONFERENCE ON THERMOELECTRICS, PROCEEDINGS ICT '03, 2003, :558-562

[2] Increased thermoelectric system thermodynamic efficiency by use of convective heat transport [J].

Bell, LE .

XXI INTERNATIONAL CONFERENCE ON THERMOELECTRICS, PROCEEDINGS ICT '02, 2002, :488-499

[3]

DEBOCK HPJ, 2007, 2 EN NAN INT C SEPT

[4] Experimental results confirming improved efficiency of thermoelectric power generation systems with alternate thermodynamic cycles [J].

Diller, RW ;

Bell, LE .

TWENTY-SECOND INTERNATIONAL CONFERENCE ON THERMOELECTRICS, PROCEEDINGS ICT '03, 2003, :571-573

[5]

HOFER DC, 2006, P GT2006 ASME TURB E

[6]

IOFFE AF, 1957, SEMICONDUCTOR THERMO, pCH2

[7]

OUYANG C, 2007, P IPACK2007 JUL VANC

[8]

ROWE DM, 1995, CRC HDB THERMOELECTR, pCH3

[9]

TAYLOR RA, 2006, IEEE T THERMAL THERM

[10] Comprehensive system-level optimization of thermoelectric devices for electronic cooling applications [J].

Taylor, Robert A. ;

Solbrekken, Gary L. .

IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2008, 31 (01) :23-31

← 1 2 →