Comprehensive system-level optimization of thermoelectric devices for electronic cooling applications

被引：54

作者：

Taylor, Robert A. ^{[1
]}

Solbrekken, Gary L. ^{[2
]}

机构：

[1] Arizona State Univ, Dept Mech & Aerosp Engn, Tempe, AZ 85287 USA

[2] Univ Missouri, Dept Mech & Aerosp Engn, Columbia, MO 65211 USA

来源：

IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES | 2008年 / 31卷 / 01期

关键词：

electronic cooling; system optimization; thermoelectric (TE);

D O I：

10.1109/TCAPT.2007.906333

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Advanced cooling solutions are needed to address the growing challenges posed by future generations of microprocessors. This paper outlines an optimization methodology for electronic system based thermoelectric (TE) cooling. This study stresses that an optimum TE cooling system should keep the electronic device below a critical junction temperature while utilizing the smallest possible heat sink. The methodology considers the electric current and TE geometry that will minimize the junction temperature. A comparison is made between the junction temperature minimization scheme and the more conventional coefficient of performance (COP) maximization scheme. It is found that it is possible to design a TE solution that will both maximize the COP and minimize the junction temperature. Experimental measurements that validate the modeling are also presented.

引用

页码：23 / 31

页数：9

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