Fabrication of thin film transistors by chemical mechanical polished polycrystalline silicon films

被引:30
作者
Chang, CY
Lin, HY
Lei, TF
Cheng, JY
Chen, LP
Dai, BT
机构
[1] NATL CHIAO TUNG UNIV,INST ELECTR,HSINCHU 300,TAIWAN
[2] NATL NANO DEVICE LABS,HSINCHU 300,TAIWAN
关键词
D O I
10.1109/55.485180
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A top-gate p-channel polycrystalline thin film transistor (TFT) has been fabricated using the polycrystalline silicon (poly-Si) film as-deposited by ultrahigh vacuum chemical vapor deposition (UHV/CVD) and polished by chemical mechanical polishing (CMP), In this process, long-term recrystallization in channel films is not needed. A maximum field effect mobility of 58 cm(2)/V-s, ON/OFF current ratio of 1.110(7), and threshold voltage of -0.54 V were obtained. The characteristics are not poor. In this work, therefore, we have demonstrated a new method to fabricate poly-Si TFT's.
引用
收藏
页码:100 / 102
页数:3
相关论文
共 9 条
[1]   HIGH-PERFORMANCE POLY-SI TFTS FABRICATED USING PULSED-LASER ANNEALING AND REMOTE PLASMA CVD WITH LOW-TEMPERATURE PROCESSING [J].
KOHNO, A ;
SAMESHIMA, T ;
SANO, N ;
SEKIYA, M ;
HARA, M .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1995, 42 (02) :251-257
[2]   DEPOSITION AND DEVICE APPLICATION OF IN-SITU BORON-DOPED POLYCRYSTALLINE SIGE FILMS GROWN AT LOW-TEMPERATURES [J].
LIN, HC ;
JUNG, TG ;
LIN, HY ;
CHANG, CY ;
LEI, TF ;
WANG, PJ ;
DENG, RC ;
LIN, JD ;
CHAO, CY .
JOURNAL OF APPLIED PHYSICS, 1993, 74 (09) :5395-5401
[3]   GROWTH OF UNDOPED POLYCRYSTALLINE SI BY AN ULTRAHIGH-VACUUM CHEMICAL-VAPOR-DEPOSITION SYSTEM [J].
LIN, HC ;
LIN, HY ;
CHANG, CY ;
LEI, TF ;
WANG, PJ ;
CHAO, CY .
APPLIED PHYSICS LETTERS, 1993, 63 (10) :1351-1353
[4]   CHARACTERISTICS AND 3-DIMENSIONAL INTEGRATION OF MOSFETS IN SMALL-GRAIN LPCVD POLYCRYSTALLINE SILICON [J].
MALHI, SDS ;
SHICHIJO, H ;
BANERJEE, SK ;
SUNDARESAN, R ;
ELAHY, M ;
POLLACK, GP ;
RICHARDSON, WF ;
SHAH, AH ;
HITE, LR ;
WOMACK, RH ;
CHATTERJEE, PK ;
LAM, HW .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1985, 32 (02) :258-281
[5]   COMPLETELY INTEGRATED CONTACT-TYPE LINEAR IMAGE SENSOR [J].
MOROZUMI, S ;
KURIHARA, H ;
TAKESHITA, T ;
OKA, H ;
HASEGAWA, K .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1985, 32 (08) :1546-1550
[6]   CHARACTERISTICS OF PLASMA-ENHANCED-CHEMICAL-VAPOR-DEPOSITION TETRAETHYLORTHOSILICATE OXIDE AND THIN-FILM-TRANSISTOR APPLICATION [J].
NISHI, Y ;
FUNAI, T ;
IZAWA, H ;
FUJIMOTO, T ;
MORIMOTO, H ;
ISHII, M .
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 1992, 31 (12B) :4570-4573
[7]  
Ohshima H., 1989, International Electron Devices Meeting 1989. Technical Digest (Cat. No.89CH2637-7), P157, DOI 10.1109/IEDM.1989.74250
[8]  
VOULTSAS AT, 1992, J ELECTROCHEM SOC, V139, P2659
[9]   CHARACTERISTICS OF HIGH-MOBILITY POLYSILICON THIN-FILM TRANSISTORS USING VERY THIN SPUTTER-DEPOSITED SIO2-FILMS [J].
YAMAUCHI, N ;
KAKUDA, N ;
HISAKI, T .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1994, 41 (10) :1882-1885