Evaluation of temperature distribution of LED module

被引：26

作者：

Fu, Han-Kuei ^{[1
]}

Wang, Chien-Ping ^{[1
]}

Chiang, Hsin-Chien ^{[1
]}

Chen, Tzung-Te ^{[1
]}

Chen, Chiu-Ling ^{[1
]}

Chou, Pei-Ting ^{[1
]}

机构：

[1] ITRI, Elect & Optoelect Res Labs, Hsinchu, Taiwan

来源：

MICROELECTRONICS RELIABILITY | 2013年 / 53卷 / 04期

关键词：

LASER DIODE;

D O I：

10.1016/j.microrel.2012.11.009

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

For high-power light-emitting diodes, heat management and reliability are important issues. The reliability and long lifetime of solid state lighting are especially essential in the high temperature applications, such as street lighting and automotive lighting. Because of the characteristics of semiconductor, the electrical property of light-emitting diodes is varying with operating temperature. Then, the alternation of electrical property changes the heating power and operating temperature of light-emitting diodes. This is a mutual interaction between electrical property and operating temperature, until they reach the steady state. In this paper, we designed experiments and calculation to optimize the simulation of temperature distribution of light-emitting diode module. With forward voltage measurement and thermal transient testing of light-emitting diodes, we obtained the initial values of simulations. The infrared camera captured the thermal images to verify the simillation results. With this method, we can effectively evaluate the temperature distribution of light-emitting diode module. (C) 2012 Elsevier Ltd. All rights reserved.

引用

页码：554 / 559

页数：6

共 11 条

[1] TEMPERATURE RISE AND THERMAL RISE-TIME MEASUREMENTS OF A SEMICONDUCTOR-LASER DIODE [J].