Microswitches with sputtered Au, AuPd, Au-on-AuPt, and AuPtCu alloy electric contacts

被引:69
作者
Coutu, Ronald A., Jr. [1 ]
Reid, James R.
Cortez, Rebecca
Strawser, Richard E.
Kladitis, Paul E.
机构
[1] USAF, Res Lab, AFRL Sensors Directorate, Aerosp Components Div, Wright Patterson AFB, OH 45433 USA
[2] USAF, Res Lab, Antenna Technol Branch, Bedford, MA 01731 USA
来源
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES | 2006年 / 29卷 / 02期
关键词
alloys; electric contacts; microelectromechanical systems (MEMS); microswitch;
D O I
10.1109/TCAPT.2006.875898
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
This paper is the first to report on a new analytic model for predicting microcontact resistance and the design, fabrication, and testing of microelectromechanical systems (MEMS) metal contact switches with sputtered bimetallic (i.e., gold (Au)-on-Au-platinum (Pt), (Au-on-Au-(6.3at%)Pt)); binary alloy (i.e., Au-palladium (Pd), (Au-(3.7at%)Pd)), and ternary alloy (i.e., Au-Pt-copper (Cu), (Au-(5.0at%)Pt-(0.5at%)Cu)) electric contacts. The microswitches with bimetallic and binary alloy contacts resulted in contact resistance values between 1-2 Omega. Preliminary reliability testing indicates a 3 x increase in switching lifetime when compared to microswitches with sputtered An electric contacts. The ternary alloy exhibited approximately a 6 x increase in switch lifetime with contact resistance values ranging from approximately 0.2-1.8 Omega.
引用
收藏
页码:341 / 349
页数:9
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