Dielectric property and microstructure of a porous polymer material with ultralow dielectric constant

被引：78

作者：

Xu, YH ^{[1
]}

Tsai, YP

Tu, KN

Zhao, B

Liu, QZ

Brongo, M

Sheng, GTT

Tung, CH

机构：

[1] Univ Calif Los Angeles, Dept Mat Sci & Engn, Los Angeles, CA 90095 USA

[2] Conexant Syst, Newport Beach, CA 92660 USA

[3] Inst Microelect, Singapore 117685, Singapore

来源：

APPLIED PHYSICS LETTERS | 1999年 / 75卷 / 06期

关键词：

D O I：

10.1063/1.124535

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

This letter reports the synthesis and dielectric properties of a porous poly(arylethers) material with an ultralow dielectric constant for interlayer dielectric applications in microelectronics. The porous polymer films were fabricated by a method of organic phase separation and evaporation. A dielectric constant of 1.8 was achieved for a porous film with an estimated porosity of 40%. The characterization of microstucture for the porous film showed numerous nanopores with an average size of 3 nm distributed uniformly throughout the film. (C) 1999 American Institute of Physics. [S0003-6951(99)01832-X].

引用

页码：853 / 855

页数：3

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