Microstructure and adhesion properties of Sn-0.7Cu/Cu solder joints

被引：42

作者：

Bae, KS ^{[1
]}

Kim, SJ ^{[1
]}

机构：

[1] Unin Suwon, Dept Elect Mat Engn, Suwon 445743, Kyunggi Do, South Korea

来源：

JOURNAL OF MATERIALS RESEARCH | 2002年 / 17卷 / 04期

关键词：

D O I：

10.1557/JMR.2002.0108

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The microstructure and adhesion strength of the Sn-0.7Cu/Cu solder joints were examined. The acicular eta(Cu6Sn5)-phase was formed inside the solder and at the solder/Cu interface, mostly in the direction normal to the interface. Compared to the Sn-3.5Ag alloy, the Sn-0.7Cu solder showed comparable wettability, but lower microhardness and joint strength. After aging, the acicular eta-phase grew into a round and scallop-shaped morphology, thin epsilon(Cu3Sn)-phase evolved just above the Cu substrate, and the joint strength decreased linearly with aging time.

引用

页码：743 / 746

页数：4

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