Directionally controlled transfer printing using micropatterned stamps

被引：35

作者：

Chen, Hang ^{[1
,2
]}

Feng, Xue ^{[1
,2
]}

Chen, Ying ^{[1
,2
]}

机构：

[1] Tsinghua Univ, Dept Engn Mech, AML, Beijing 100084, Peoples R China

[2] Tsinghua Univ, Ctr Mech & Mat, Beijing 100084, Peoples R China

来源：

APPLIED PHYSICS LETTERS | 2013年 / 103卷 / 15期

基金：

中国国家自然科学基金;

关键词：

PEEL ADHESION; MECHANICS; ADHERENCE; FRACTURE; GECKO; FILM;

D O I：

10.1063/1.4824976

中图分类号：

O59 [应用物理学];

学科分类号：

070305 [高分子化学与物理];

摘要：

Kinetically controlled transfer printing based on rate-dependent adhesion is widely used to heterogeneously integrate micro/nano-devices. Through analysis of peeling stamps with grating-like micropatterns from the rigid substrate in different directions, the directionally dependent adhesion strength is investigated in detail. Experiments of peel test and picking up silicon ribbons from silicon-on-insulator wafer were conducted and consistent with the analytical prediction. The method and analytical results proposed in this Letter can guide the design of the micropatterns on stamp to realize a more effective transfer printing approach. (C) 2013 AIP Publishing LLC.

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页数：4

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