Laser ablation and micromachining with ultrashort laser pulses

被引:833
作者
Liu, X
Du, D
Mourou, G
机构
[1] Center for Ultrafast Optical Science, University of Michigan, Ann Arbor
[2] Clark-MXR, Inc., Dexter
基金
美国国家科学基金会;
关键词
ablation; laser materials; processing applications; ultrafast optics;
D O I
10.1109/3.631270
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The mechanisms of ultrashort-pulse laser ablation of materials are discussed, the differences to that of long laser pulses are emphasized. Ultrashort laser pulses offer high laser intensity and offer precise laser-induced breakdown threshold with reduced laser fluence. The ablation of materials with ultrashort pulses has a very limited heat-affected volume. These advantages of ultrashort laser pulses are applied in precision micromachining of various materials. Some femtosecond laser pulse micromachining results, including comparison with long pulses, are presented. Ultrashort-pulse laser micromachining may have a wide range of applications where micrometer and submicrometer feature sizes are required.
引用
收藏
页码:1706 / 1716
页数:11
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